Katarina Boustedt
Summary:

Agile and structured senior program manager who can think outside the box and see solutions.
PhD in Electronics Packaging and Production, with five international patents.
Certified Project Manager Professional (PMP).

Proven ability to lead teams and develop working methods for very large projects/programs in research. Experience from stakeholders’ management and funding agencies such as EC and Vinnova.

Very passionate about tech transfer, industrialization, producibility and high-volume production aspects, with hand-on experience from setting up global processes in mobile phone production and sourcing its equipment and materials.

Currently research project manager at AstaZero AB, a small company running the world’s first full-scale independent test environment for future road safety, working with testing of autonomous, connected and automated vehicles.

Selected publications at Scopus: https://orcid.org/0000-0003-2053-7166

Current work and assignments

  • August 2018 – present: Research project manager at AstaZero AB, leading projects on various aspects of automated, connected, autonomous vehicles for a sustainable society. Scouting for strategic collaborations, funding and other opportunities that fit AstaZero’s roadmap. Heading the work with Introduce a Girl to Engineering Day at AstaZero
  • 2015 – present: Scientific expert reviewer for the European Commission, serving at project reviews to monitor and advise on the progress of research projects
  • 2017 – present: Representing Chalmers’ President on the board of ChaseOn and GHz competence centres

Previous Employment

  • October 2013 – August 2018: Project manager, division leader and Head of Administration, Graphene Flagship at Chalmers University of Technology. Leader of work package “Research Management”, which involved interaction with all work packages, monitoring the research progress, as well as collecting, editing and submitting all technical reports and deliverables to the European Commission. Responsibilities also included the Graphene Flagship roadmap, Samples and Materials Database and the work on standardization.
  • April 2007 – September 2013: Senior Research Engineer at the Microwave and High Speed Electronics Research Center at Ericsson AB in Mölndal, Sweden.
  • September 2008 – March 2012: Received the Vinnova grant VINNMER for female doctorate researchers. The long-term objective of the VINNMER program is to help to increase the number of postgraduates that can become the leaders of the future at universities/colleges, centers, research institutes and companies.
  • October 2007: PhD degree, Örebro University – ”Flip Chip for High Frequency Applications – Materials Aspects”
  • April 2007: Appointed Senior Research Engineer at Core Unit Research Center, High Speed and Microwave Electronics at Ericsson AB in Mölndal
  • November 2004: Returned to Core Unit Research Center, Microwave and High Speed Electronics at Ericsson AB in Mölndal – Packaging and Interconnection, Advanced chip interconnect techniques for high speed chips and packaging issues for future products.
  • October 2002: Licentiate of Engineering degree, Örebro University – ”Flip Chip for High Volume and Low Cost – Materials and Production Technology”
  • November 2001 – October 2007: Industrial PhD student at Örebro University, Electronics Production Engineering (EPE) financed and employed by Ericsson AB
  • (May 2002: Ericsson Mobile Communications in Kumla becomes Ericsson AB)
  • 2001 – 2004: Gradually moved to full time packaging assignments for Ericsson Research in Kista and Mölndal
  • Secretary/Webmaster of IMAPS Nordic January 1997 – December 2000, Webmaster only January 2001 – December 2004
  • August 1999 – October 2004: Ericsson Mobile Communications (ECS), Kumla – Packaging and Interconnection, spec. flip chip. Set up an underfill process, including selection of materials and equipment, which was cloned to all Ericsson plants worldwide.
  • May 1997 – July 1999: Ericsson Microwave Systems (EMW), Core Unit Research Center, Microwave and High Speed Electronics, Mölndal – Packaging and Interconnection, Advanced chip interconnect techniques for high speed chips and packaging issues for future products. Suppliers’ quality assurance and audits for JAS Gripen chips.
  • 1990 – April 1997: Project manager of packaging and interconnection research projects at the Department of Electronics Packaging at IVF, the Swedish Institute of Production Engineering Research. Topics: advanced packaging, such as flip chip, chip scale packaging, and high-density substrates techniques. A number of reports and papers are available. Reliability and failure analysis of electronics using scanning electron microscopy, scanning acoustic microscopy, etc.
  • Engineering Physics, major in Materials Science at Chalmers University of Technology.

Recent tasks

  • Responsible for technical coordination and administration of the Graphene Flagship (Chalmers)
  • Responsible for industrialization aspects towards volume production of research results on RF MEMS, in collaboration with Italian university spin-off RF Microtech (Ericsson)
  • Investigating packaging and interconnect for future low-cost E-band products (Ericsson)
  • During 2010 – 2012 project manager for Ericsson internal project “SPEED – Towards Terabit”, involving researchers from Ericsson in Sweden and Italy, as well as external resources at universities and institutes in Sweden, Italy and Brazil. Work package responsible in FP7 ICT “Apache” on optoelectronics packaging for terabit transmission.
  • Visiting researcher at Chalmers University of Technology MC2 Photonics under the VINNMER grant.
  • Invited lecturer in M. Sc. student courses in electronics packaging at Linköping Institute of Technology and Örebro University.
  • Author of the chapter ”Interconnections for High-Frequency Applications”, in ”Area Array Interconnection Handbook”, editors Karl Puttlitz and Paul A Totta, Kluwer Publishing, 2001, ISBN 0-7923-7919-5.
  • Industry mentor for Staffan Karlsson, MEMS (Micro Electro Mechanical Systems) packaging Ph. D. student at Uppsala University, Ångström Labs

World Patents Awarded

  1. Derwent PAN 2000-303885 Printed circuit board and method of its manufacture (P08951SE1 Buried components in PCB based on RC-foil and/or lacquered dielectric), 6 October 1998, Leif Bergstedt, Per Ligander, Katarina Boustedt
  2. Derwent PAN 2000-292920 Method and device for buried chips (P09478SE1 Buried bumped chips), 21 September 1998, Leif Bergstedt, Per Ligander, Katarina Boustedt
  3. Derwent PAN 2000-399233 An electronic arrangement comprising a component carrier, a carrier for an electronic component, and a method of producing an electronic arrangement. (P09475SE1 Component and carrier leveled), 9 September 1998, Leif Bergstedt, Katarina Boustedt, Per Ligander
  4. Derwent PAN 2000-246812 Vertical connection method for vertically connecting the conductors in a device for example printed circuit board (P09477SE1, Two layer microstrip connection in PCB), 28 August 1998, Leif Bergstedt, Katarina Boustedt
  5. Derwent PAN 2001-315858 Semiconductor element mounting arrangement for example for IC, has PCB provided with positioning bumps, at least one among which is electrically insulated from integrated circuitry, 17 May 1999, Leif Bergstedt, Katarina Boustedt

Publications

Conference and Magazine Papers

  1. Low Cost E-Band Flip Chip Assembly and Materials, Katarina Boustedt, Per Ligander, IEEE Electronics Components and Packaging Conference, 28 – 31 May 2013, Las Vegas NV, USA.
  2. Transmission Performance of Mixed Line-Rate and Format DWDM Traffic Using a 10x10Gb/s Photonic Integrated Transceiver Array for Low-Cost Metro Networks, M. Bougioukos, L. Gleeson, P. Zakynthinos, M. Spyropoulou, S. Dris, R. Magri, M. Camera, D. Klonidis, I. Tomkos, B. Schrenk, P. Bakopoulos, D. Apostolopoulos, Ch. Kouloumentas, D. Rogers, A. Poustie, G. Maxwell, R. Stoffer, T. Korthorst, K.-O. Velthaus, R. Kaiser, L. Moerl, K. Boustedt and H. Avramopoulos, Optical Fiber Communication Conference and Exposition (OFC/NFOEC), 2012 and the National Fiber Optic Engineers Conference, 4 – 8 March 2012, Los Angeles, CA, USA.
  3. Dense WDM-PON with 23(46) Gb/s/λ D(Q)PSK Aggregation in the Feeder and Micro-Ring Resonator Assisted ONUs, M. Bougioukos, B. Schrenk, A. Maziotis, M. Spyropoulou, Ch. Kouloumentas, K.-O. Velthaus, R. Kaiser, A. Poustie, G. Maxwell, K. Boustedt, R. Magri and H. Avramopoulos, Optical Fiber Communication Conference and Exposition (OFC/NFOEC), 2012 and the National Fiber Optic Engineers Conference, 4 – 8 March 2012, Los Angeles, CA, USA.
  4. Reliability Issues of Silicon Substrate Integrated Ferroelectric Capacitors, K. Boustedt and S. Gevorgian, 8th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF 2008), 23 – 25 January 2008, Orlando, FL, USA.
  5. High Gain Active Microstrip Antenna for 60 GHz WLAN, Camilla Kärnfelt, Paul Hallbjörner, Herbert Zirath, Per Ligander, Katarina Boustedt, Arne Alping, 2005 European Microwave Conference, Volume 1, 4 – 6 Oct. 2005, Paris, France.
  6. Lead-Free Flip Chip Assembly Process, Katarina Boustedt, Conf. on New Exploratory Technology, 25 – 26 October 2004, Salo, Finland (invited speaker)
  7. GaAs Flip-Chip Evaluation in the 3 to 110 GHz Range, Camilla Kärnfelt, Janosz Rudnicki, J Piotr Starski, Herbert Zirath, Katarina Boustedt, European Microelectronics and Packaging Symposium, 16 – 18 June 2004, Prague, Czech Rep.
  8. High Volume Aspects of Flip Chip Technology, Katarina Boustedt, Swedish System-on-Chip Conference, 13 – 14 April 2004, Båstad, Sweden.
  9. GHz Flip Chip Interconnect Experiments, Katarina Boustedt, Camilla Kärnfelt, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 24 – 26 March, 2004, Atlanta, GA, USA.
  10. Wafer Bonding Technologies for MEMS Packaging, Katarina Boustedt, Katrin Persson, Sofie Bohman, Dag Stranneby, IMAPS Nordic Annual Conference, 29 September – 2 October 2002, Stockholm, Sweden.
  11. Processing and Reliability of Flip Chip With Lead-Free Solders on Halogen-Free Microvia Substrates, Daniel F. Baldwin, Grant Baynham, Katarina Boustedt, Claes Wennerholm, 27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium 17 – 18 July 2002, pp 310 – 315, Santa Clara, CA, USA
  12. Flip Chip as an Enabler for MEMS Packaging, Katarina Boustedt, Katrin Persson, Dag Stranneby, IEEE 52nd Electronics Components and Technology Conference (ECTC), 28 – 31 May 2002, San Diego, CA, USA
  13. Increasing Interest for MEMS in Telecommunications, Katarina Boustedt, Kåre Gustafsson, Shu-Ang Zhou, Micro Structure Workshop, 20 – 21 March 2002, Bålsta, Sweden
  14. Low Cost Wafer Level Packaging for MEMS, Katarina Boustedt, Katrin Persson, Wafer Level Packaging Workshop 1 – 2 March 2002, Atlanta, GA, USA
  15. Fundamental Requirements on MEMS Packaging and Reliability, Katarina Boustedt, Katrin Persson, 8th International Symposium on Advanced Packaging Materials, 3 – 6 March 2002, Atlanta, GA, USA
  16. Benefits of MEMS Wafer Level Packaging, Katrin Persson, Katarina Boustedt, IMAPS Advanced Technology Workshop on Packaging of MEMS and Related Micro Integrated Nano Systems, 8 – 10 November 2001, Scotts Valley, CA, USA
  17. Reliability Performance of Flip Chip Processing with Lead-Free Solders and Halogen-Free High Density Microvia Substrates, Grant Baynham, Daniel F. Baldwin, Katarina Boustedt, Claes Wennerholm, IMAPS Nordic 38th Annual Conference, 23 – 26 September 2001, Oslo, Norway
  18. Flip Chip with Lead-Free Solders on Halogen-Free Microvia Substrates, Grant Baynham, Daniel F. Baldwin, Katarina Boustedt, Claes Wennerholm, IEEE 51st Electronics Components and Technology Conference (ECTC), 29 May – 1 June 2001, Lake Buena Vista, FL, USA
  19. Using Lead-Free Solders and Halogen-Free Boards for Low Cost Flip Chip Applications, Katarina Boustedt, Claes Wennerholm, Leena Korhonen, International Convention on ”Leadfree Interconnection Technology and Green Materials”, 26 – 27 October 2000, Waiblingen Germany (invited speaker)
  20. Lead-Free Flip Chip Processing with Halogen-Free High Density Microvia Substrates, Grant Baynham, Daniel F. Baldwin, Katarina Boustedt, Stefan Kandelid, Fredrik Mattsson, Claes Wennerholm, Anette Johansson, Deborah Patterson, Peter Elenius, Haluk Balkan, Twenty-Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium, 2 – 3 Oct 2000. pp. 263 – 269, Santa Clara, CA, USA
  21. Flip Chip with Lead-Free Solders on Halogen-Free Microvia Substrates, Grant Baynham, Daniel F. Baldwin, Katarina Boustedt, Anette Johansson, Claes Wennerholm, Stefan Kandelid, Fredrik Mattsson, Deborah Patterson, Peter Elenius, IMAPS Nordic 37th Annual Conference, 10 – 13 September 2000, Helsingør, Denmark
  22. A Simple Probe Card for Testing Bumped Fine Pitch Devices, Staffan Karlsson, Stefan Johansson, Katarina Boustedt, IMAPS Nordic 37th Annual Conference, 10 – 13 September 2000, Helsingør, Denmark
  23. Flip Chip with Lead-Free Solders on Halogen-Free Microvia Boards, Grant Baynham, Daniel F. Baldwin, Katarina Boustedt, Anette Johansson, Claes Wennerholm, Stefan Kandelid, Fredrik Mattsson, Deborah Patterson, Peter Elenius, SMT 2000, 27 – 29 June 2000, Nuremberg, Germany (invited speaker)
  24. Flip Chip Processing of Lead-Free Solders and Halogen-Free High Density Microvia Substrates, Grant Baynham, Daniel F. Baldwin, Katarina Boustedt, Anette Johansson, Claes Wennerholm, Deborah Patterson, Peter Elenius, IEEE 50th Electronics Components and Technology Conference (ECTC), 21 – 24 May 2000, Las Vegas, NV, USA
  25. A New Flexible Building Technique for Microsystems, Staffan Karlsson, Stefan Johansson, Katarina Boustedt, IMAPS Nordic 36th Annual Conference, 19 – 22 September 1999, Helsinki, Finland
  26. On Microwave MCMs in PTFE, Leif Bergstedt, Katarina Boustedt, Per Ligander, The Third International Symposium on Electronic Packaging Technology (ISEPT&apo;98), August 17 – 20 1998, Beijing, China
  27. GHz Flip Chip – An Overview, Katarina Boustedt, IEEE 48th Electronics Components and Technology Conference (ECTC), May 25 – 28 1998, Seattle, WA, USA
  28. A New Concept for Microwave MCMs, Leif Bergstedt, Katarina Boustedt, 2nd 1998 IEMT/IMC Symposium, 15 – 17 April 1998, Omiya, Japan
  29. Tomorrow’s Packaging – Chip Scale Packaging vs. Flip Chip, Katarina Boustedt, E Jan Vardaman, Microelectronics International, Vol. 14 No. 3, September 1997, pp. 31-32
  30. IC Packaging and Assembly Issues for Next Generation miniaturized Consumer Electronics, Co van Veen, Katarina Boustedt, Future Circuits International, Issue 1, vol. 1, pp. 51 – 54, 1997
  31. The Chip Scale Packaging Task Force – Early Experimental Results, Katarina Boustedt, Roger Rörgren, Per-Erik Tegehall, Surface Mount International, 7 – 11 September 1997, San Jose, CA, USA
  32. Results from an Evaluation of Different SBU Technologies, Mats Lindgren, Per Carlsson, Katarina Boustedt, Surface Mount International, 7 – 11 September 1997, San Jose, CA, USA
  33. Are Today’s PWBs Compatible with Flip Chip and Chip Scale Packaging?, Katarina Boustedt, Leif Bergstedt, MQS Nordic Days, 27 – 28 August 1997, Gothenburg, Sweden
  34. Flip-Chip Underfill – Interaction in a Complex System, Katarina Boustedt, Low Cost Flip Chip Workshop, 7 – 9 March 1997, Braselton, GA, USA (invited speaker)
  35. The Chip Scale Packaging Task Force – Users and Manufacturers Working Together, Katarina Boustedt, Per-Erik Tegehall, Second International Conference on Chip Scale Packaging (Chipcon), February 1997, Sunnyvale, CA, USA
  36. Influence of Contaminants from the Production Process on the Reliability of Sequential Build-up Circuit Boards, Mats Lindgren, Per Carlsson, Katarina Boustedt, Per-Erik Tegehall, Recent Progress in Printed Circuit Board Technology, 27 – 29 January 1997, Berlin, Germany
  37. Tomorrow’s Packaging – Chip Scale Packaging vs. Flip-chip, Katarina Boustedt, European Surface Mount Conference, 12 – 14 November 1996, Brighton, UK (invited speaker)
  38. Flip-Chip with Eutectic Pb/Sn Bumps – A Proposed Process Flow, Katarina Boustedt, ISHM-Nordic 34th Annual Conference, 22 – 25 September 1996, Helsingør, Denmark
  39. Evaluation of Underfill Materials for Eutectic Reflow Flip Chip on FR4, Katarina Boustedt, Adhesives in Electronics, 3 – 5 June 1996, Stockholm, Sweden
  40. Flip-Chip – The Ultimate Solution Comparing Flip-Chip and Chip Scale Packaging, Bill Brox, Katarina Boustedt, ISHM Workshop, May 1996, Prague, Czech Rep
  41. A Comparison Between CSP, SMT, and Flip-Chip, Bill Brox, Katarina Boustedt, SEMICON Europa 96, 27 – 29 March, 1996, Geneva, Switzerland
  42. Evaluation of Underfill Materials for Eutectic Reflow Flip-Chip on FR-4, Katarina Boustedt, The 1996 Workshop on VLSI and Microsystems Packaging Technologies and Manufacturing, 6 – 7 May, 1996, Baveno, Italy
  43. Flip-Chip Interconnection Systems – An Overview, Katarina Boustedt and Bill Brox, First International Conference & Exhibition on Emerging Microelectronics and Interconnection Technologies (EMIT’96), 12 – 16 February 1996, Bangalore, India
  44. Underfill Evaluation for Eutectic Bumped Flip-Chips on FR-4, Katarina Boustedt, 1996 International Flip Chip, Ball Grid Array, TAB and Advance Packaging Symposium (ITAP), 14 – 16 February 1996, San Jose, CA, USA
  45. Development of Chip Joining Technology on Flexible Circuitry Using Anisotropically Conductive Adhesives and Eutectic Solder, Johan Liu, Katarina Boustedt, Zonghe Lai, Surface Mount International, 29 – 31 August 1996, San Jose, CA, USA
  46. The Nordic Flip-Chip Project: Experimental Studies, Katarina Boustedt, Per Hedemalm, 10th European Microelectronics Conference (ISHM Nordic), 14 – 17 May 1995, Copenhagen, Denmark
  47. The Nordic Flip-Chip Project: Experimental Studies, Katarina Boustedt, Per Hedemalm, 1995 International Flip Chip, Ball Grid Array, TAB and Advance Packaging Symposium (ITAP), 14 – 17 February 1995, San Jose, CA, USA
  48. Flip-Chip Assembly on Laminated Multichip Modules, Katarina Boustedt, Per Hedemalm, First International Symposium on Flip Chip Technology (ITAP), 15 – 18 February 1994, San Jose, CA, USA

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